Rework Serviceのメーカーや取扱い企業、製品情報、参考価格、ランキングをまとめています。
イプロスは、 製造業 BtoB における情報を集めた国内最大級の技術データベースサイトです。

Rework Service - メーカー・企業4社の業務用製品ランキング | イプロスものづくり

Rework Serviceの製品一覧

1~7 件を表示 / 全 7 件

表示件数

BGA Rework and Reballing Support [Case Study Introduction]

Support for BGA rework and reballing that cannot afford to fail.

At Kei All, we accept BGA rework even for boards that are not implemented in our own line. If it is at an early stage of the process, rework may be easily performed. We often receive requests for difficult BGA rework and reballing from other assembly companies in the industry. We support "BGA rework and reballing work that cannot afford to fail," especially for high-cost and hard-to-obtain devices. [Features] - Support for device rework - BGA rework compatible For more details, please contact us or download the catalog.

  • BGA6.jpg
  • BGA5.jpg
  • BGA4.jpg
  • BGA3.jpg
  • BGA2.jpg
  • BGA.jpg
  • Other contract services
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

BGA/CSP rework/prototype modification

Quick and reliable short delivery times available! Small lots are also acceptable, with production possible from just one unit.

Our company specializes in BGA and CSP rework/prototyping modifications. We offer manufacturing services such as prototyping for surface mount boards that can accommodate BGA and CSP, as well as modifications like pattern cutting. Additionally, we excel in BGA and CSP assembly and rework tasks. From defect detection to assembly and inspection, we utilize specialized equipment and the skills we have developed over time, and we look forward to your inquiries. 【Manufacturing Services Offered】 ■ Prototyping ■ Unit Assembly ■ Modification ■ Cable Creation ■ In-house Procurement *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Prototype Services
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Removal/Installation of BGA Components

Using dedicated rework equipment! We can flexibly accommodate packages with strict conditions.

We would like to introduce the "Removal/Installation of BGA Components" conducted by Ruiling Electric Co., Ltd. In recent years, BGA (Ball Grid Array) components for memory and ASICs have become mainstream, and it is very difficult to remove/install these components with conventional tools. Our company uses dedicated rework equipment and manages temperature through temperature profiles, allowing us to flexibly handle not only standard BGAs but also packages with strict conditions, such as POP. Additionally, by using rework equipment, we have improved the reliability of the removal/installation of these components. 【Features】 ■ Use of dedicated rework equipment ■ Flexible response to packages with strict conditions ■ Improved reliability of removal/installation of these components through the use of rework equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Rework Service <EMS Solution>

We also offer "Rework Technical Consulting," where we dispatch experienced engineers from our company!

At Higashi Electronic Industry Co., Ltd., we accept rework of various types of mounted components (SMD, IMD), including BGA (Ball Grid Array). By performing BGA reballing, it is possible to reuse components (reinstallation on different boards due to component depletion, failure analysis of individual components, failure analysis and reproducibility confirmation through component swap reinstallation, etc.). We can also handle the removal (live capture) of components other than BGA that you wish to reuse, as well as modifications to the circuit board. 【Supported Patterns】 ■1. New component rework ■2. New component post-installation ■3. Removal (live capture) ■4. Component regeneration/reinstallation ■5. Component regeneration only *For more details, please refer to the related links or feel free to contact us.

  • Other electronic parts
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

EMS Solution Rework Service

For those who have no rework experience or have rework equipment but are unable to use it effectively!

We perform rework on various types of mounted components (SMD, IMD). We offer five patterns of service: "new component rework," "new component addition," "removal (live capture)," "component regeneration/re-implementation," and "component regeneration only." Additionally, we possess rework equipment from reliable domestic manufacturers, allowing us to measure and provide temperature profiles as needed. 【Rework Lineup for Mounted Components (partial)】 ■BGA ■QFP ■SOP ■PLCC ■HTD *For more details, please download the PDF or feel free to contact us.

  • Circuit board design and manufacturing
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

High-Difficulty Implementation and Rework [Case Study Introduction]

Supports high-density, ultra-miniaturized components! Capable of handling high-difficulty assembly and rework.

At Kei All, we are capable of handling high-difficulty implementations and reworks. Recently, there has been a significant increase in components such as leads and thermal pads. These types of components can be very difficult to rework due to their shape and the configuration of the circuit board, as they tend to be less susceptible to heat. Rework technology is one of Kei All's proud strengths. We are continuously honing our skills to address high-difficulty components, which have been increasing in number due to the miniaturization and high density of parts. 【Features】 ○ Support for high-density, ultra-miniature components such as small camera modules and fine-pitch 0.3mm devices ○ Capability for high-difficulty implementations and reworks ○ Continuous technical training and skill development For more details, please contact us or download the catalog.

  • 高難易度の実装・リワーク2.jpg
  • 高難易度の実装・リワーク.jpg
  • リワーク8.jpg
  • リワーク7.jpg
  • リワーク5.jpg
  • リワーク4.jpg
  • リワーク3.jpg
  • リワーク2.jpg
  • リワーク.jpg
  • Other contract services
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

BGA/CSP implementation and rework work Rework service

Implementation and rework of BGA and CSP, solving everything from defect detection to implementation and inspection with specialized equipment and the skills we have developed over time!

At Shimizu Electric, we specialize in the assembly and rework of BGA and CSP. We are ready to assist our customers with everything from defect detection to assembly and inspection, using specialized equipment and the skills we have developed over the years. 【What can be done in rework operations】 1. Detection of soldering defects in BGA and CSP 2. Removal of BGA and CSP (BGA and CSP rework equipment) 3. BGA and CSP reballing (BGA and CSP reballing) 4. Assembly of BGA and CSP (BGA and CSP rework equipment) 5. Soldering of BGA and CSP (BGA and CSP rework equipment, N2-compatible reflow equipment) 6. X-ray inspection of BGA and CSP (X-ray inspection equipment)

  • Contract manufacturing
  • Processing Contract
  • Other contract services
  • Rework Service

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録